- 专利标题: Multilayer capacitor
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申请号: US16778965申请日: 2020-01-31
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公开(公告)号: US11322305B2公开(公告)日: 2022-05-03
- 发明人: Won Kuen Oh , Hye Hun Park , Tae Gyeom Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2019-0108057 20190902
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G2/06
摘要:
A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
公开/授权文献
- US20210065984A1 MULTILAYER CAPACITOR 公开/授权日:2021-03-04
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