- 专利标题： High density 3D interconnect configuration
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申请号： US16783132申请日： 2020-02-05
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公开(公告)号： US11309246B2公开(公告)日： 2022-04-19
- 发明人: Sanjay Dabral , Zhitao Cao , Kunzhong Hu , Jun Zhai
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Aikin & Gallant, LLP
- 主分类号： H01L23/528
- IPC分类号： H01L23/528 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; H05K1/11 ; H05K1/18 ; H01L23/00
摘要：
Electronic package structures and systems are described in which a 3D interconnect structure is integrated into a package redistribution layer and/or chiplet for power and signal delivery to a die. Such structures may significantly improve input output (IO) density and routing quality for signals, while keeping power delivery feasible.
公开/授权文献
- US20210242170A1 HIGH DENSITY 3D INTERCONNECT CONFIGURATION 公开/授权日：2021-08-05
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