Invention Grant
- Patent Title: Deflectable platens and associated methods
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Application No.: US16657020Application Date: 2019-10-18
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Publication No.: US11302536B2Publication Date: 2022-04-12
- Inventor: Ming Yin , Dawei Sun
- Applicant: APPLIED Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED Materials, Inc.
- Current Assignee: APPLIED Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/324 ; H01L21/20 ; H01L21/683
Abstract:
A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.
Public/Granted literature
- US20210118692A1 DEFLECTABLE PLATENS AND ASSOCIATED METHODS Public/Granted day:2021-04-22
Information query
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