Invention Grant
- Patent Title: Chamber apparatus for chemical etching of dielectric materials
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Application No.: US14747367Application Date: 2015-06-23
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Publication No.: US11302520B2Publication Date: 2022-04-12
- Inventor: Tien Fak Tan , Dmitry Lubomirsky , Kirby H. Floyd , Son T. Nguyen , David Palagashvili , Alexander Tam , Shaofeng Chen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
Implementations of the disclosure generally provide an improved pedestal heater for a processing chamber. The pedestal heater includes a temperature-controlled plate having a first surface and a second surface opposing the first surface. The temperature-controlled plate includes an inner zone comprising a first set of heating elements, an outer zone comprising a second set of heating elements, the outer zone surrounding the inner zone, and a continuous thermal choke disposed between the inner zone and the outer zone, and a substrate receiving plate having a first surface and a second surface opposing the first surface, the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate. The continuous thermal choke enables a very small temperature gradient to be created and manipulated between the inner zone and the outer zone, allowing center-fast or edge-fast etching profile to achieve on a surface of the substrate.
Public/Granted literature
- US20150380220A1 CHAMBER APPARATUS FOR CHEMICAL ETCHING OF DIELECTRIC MATERIALS Public/Granted day:2015-12-31
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