- 专利标题: Holder for holding substrate and system for plating
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申请号: US16609884申请日: 2018-06-12
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公开(公告)号: US11299817B2公开(公告)日: 2022-04-12
- 发明人: Shota Moriyama , Matsutaro Miyamoto
- 申请人: EBARA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: EBARA CORPORATION
- 当前专利权人: EBARA CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: BakerHostetler
- 优先权: JPJP2017-126582 20170628,JPJP2018-079388 20180417
- 国际申请: PCT/JP2018/022391 WO 20180612
- 国际公布: WO2019/003891 WO 20190103
- 主分类号: C25D17/08
- IPC分类号: C25D17/08 ; C25D21/00
摘要:
There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.
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