- 专利标题: Direct formation of hexagonal boron nitride on silicon based dielectrics
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申请号: US16726406申请日: 2019-12-24
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公开(公告)号: US11289577B2公开(公告)日: 2022-03-29
- 发明人: Vikas Berry , Sanjay Behura , Phong Nguyen , Michael R. Seacrist
- 申请人: GlobalWafers Co., Ltd. , Board of Trustees of the University of Illinois
- 申请人地址: TW Hsinchu; US IL Chicago
- 专利权人: GlobalWafers Co., Ltd.,Board of Trustees of the University of Illinois
- 当前专利权人: GlobalWafers Co., Ltd.,Board of Trustees of the University of Illinois
- 当前专利权人地址: TW Hsinchu; US IL Chicago
- 代理机构: Armstrong Teasdale LLP
- 主分类号: H01L29/267
- IPC分类号: H01L29/267 ; H01L21/02 ; H01L29/45 ; H01L29/66 ; H01L29/786 ; H01L21/283 ; H01L21/285
摘要:
A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
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