- 专利标题： Integrated conductive polymer binder composition, method for preparing the binder composition, and applications comprising the binder composition
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申请号： US15021564申请日： 2014-09-16
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公开(公告)号： US11257606B2公开(公告)日： 2022-02-22
- 发明人: Hyeonseok Yoon , Minjeong Kang
- 申请人： INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
- 申请人地址： KR Gwangju
- 专利权人： INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
- 当前专利权人： INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
- 当前专利权人地址： KR Gwangju
- 代理机构： The PL Law Group, PLLC
- 优先权： KR10-2013-0111561 20130917,KR10-2014-0122540 20140916
- 国际申请： PCT/KR2014/008603 WO 20140916
- 国际公布： WO2015/041440 WO 20150326
- 主分类号： C09D165/00
- IPC分类号： C09D165/00 ; H01B1/12 ; C09D5/08 ; C09D179/02 ; C09D179/04 ; H01G11/48 ; H01G11/86 ; H01G11/38 ; C08G73/02 ; C08L79/02 ; C08J3/09 ; C08J3/11 ; C09D7/40 ; C08K5/053 ; C09D5/24 ; C08G61/12
摘要：
The present invention relates to a polymer binder composition, and more specifically, to an integrated conductive polymer binder composition simultaneously having adhesion and conductivity, a method for preparing the binder composition, an energy storage device comprising the binder composition, a sensor comprising a sensing portion formed from the binder composition, and an anticorrosive coating composition comprising the binder composition as an active component.
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