发明授权
- 专利标题: Chip antenna
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申请号: US17002006申请日: 2020-08-25
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公开(公告)号: US11245192B2公开(公告)日: 2022-02-08
- 发明人: Dae Ki Lim , Young Sik Hur , Kyu Bum Han , Ju Hyoung Park , Myeong Woo Han , Jeong Ki Ryoo
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: NSIP Law
- 优先权: KR10-2020-0040210 20200402
- 主分类号: H01Q9/04
- IPC分类号: H01Q9/04 ; H01Q1/02 ; H01Q1/22
摘要:
A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.
公开/授权文献
- US20210313694A1 CHIP ANTENNA 公开/授权日:2021-10-07
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