- 专利标题： Method of fabricating array substrate, array substrate, and display apparatus
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申请号： US16616965申请日： 2018-06-19
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公开(公告)号： US11245037B2公开(公告)日： 2022-02-08
- 发明人: Shengguang Ban , Zhanfeng Cao , Qi Yao
- 申请人： BOE Technology Group Co., Ltd.
- 申请人地址： CN Beijing
- 专利权人： BOE Technology Group Co., Ltd.
- 当前专利权人： BOE Technology Group Co., Ltd.
- 当前专利权人地址： CN Beijing
- 代理机构： Intellectual Valley Law, P.C.
- 优先权： CN201710772525.0 20170831
- 国际申请： PCT/CN2018/091784 WO 20180619
- 国际公布： WO2019/041976 WO 20190307
- 主分类号： H01L29/786
- IPC分类号： H01L29/786 ; H01L29/66 ; H01L21/02 ; H01L27/12
摘要：
The present application provides an array substrate. The array substrate includes a base substrate; a light shielding layer on the base substrate; a metal oxide layer on a side of the light shielding layer distal to the base substrate; and an active layer on a side of the metal oxide layer distal to the base substrate. The metal oxide layer includes a metal oxide material. The light shielding layer includes amorphous silicon. An orthographic projection of the light shielding layer on the base substrate substantially overlaps with an orthographic projection of the active layer on the base substrate, and substantially overlaps with an orthographic projection of the metal oxide layer on the base substrate.
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