- 专利标题： Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition
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申请号： US16761668申请日： 2018-10-31
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公开(公告)号： US11244878B2公开(公告)日： 2022-02-08
- 发明人: Kyoko Nishidono , Takahiro Akashi
- 申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 申请人地址： JP Osaka
- 专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址： JP Osaka
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： JPJP2017-219228 20171114,JPJP2018-015698 20180131
- 国际申请： PCT/JP2018/040473 WO 20181031
- 国际公布： WO2019/098026 WO 20190523
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L21/00 ; H01L23/31 ; H01L23/544 ; H01L31/048 ; H01L51/52 ; H01L33/56 ; H01L33/52
摘要：
A semiconductor-chip-encapsulating resin composition according to the present disclosure contains: an epoxy resin; a curing agent; and a low-valent titanium oxide, of which a titanium atom has an oxidation number less than +IV. A semiconductor package according to the present disclosure includes: a semiconductor chip; and an encapsulation resin which covers the semiconductor chip and which is a cured product of the semiconductor-chip-encapsulating resin composition.
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