- 专利标题: Etching to reduce line wiggling
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申请号: US16679940申请日: 2019-11-11
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公开(公告)号: US11244858B2公开(公告)日: 2022-02-08
- 发明人: Kuan-Wei Huang , Cheng-Li Fan , Yu-Yu Chen
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L23/535 ; H01L21/033 ; H01L23/522 ; H01L23/532 ; H01L21/311
摘要:
A method for reducing wiggling in a line includes forming a first patterning layer over a metal feature and depositing a first mask layer over the first patterning layer. The first mask layer is patterned to form a first set of one or more openings therein and then thinned. The pattern of the first mask layer is transferred to the first patterning layer to form a second set of one or more openings therein. The first patterning layer is etched to widen the second set of one or more openings. The first patterning layer may be comprised of silicon or an oxide material. The openings in the first patterning layer may be widened while a mask layer is over the first patterning layer.
公开/授权文献
- US20200075405A1 Etching to Reduce Line Wiggling 公开/授权日:2020-03-05
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