Invention Grant
- Patent Title: Methods of packaging semiconductor devices and packaged semiconductor devices
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Application No.: US14318180Application Date: 2014-06-27
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Publication No.: US11239138B2Publication Date: 2022-02-01
- Inventor: Li-Hui Cheng , Po-Hao Tsai , Jing-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/00 ; H01L21/56 ; H01L21/768 ; H01L21/683 ; H01L21/3105 ; H01L21/78 ; H01L23/538 ; H01L23/00 ; H01L23/498 ; H05K1/18 ; H01L21/48 ; H01L23/31
Abstract:
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling through-vias to an insulating material, each of the through-vias having a first width. Dies are also coupled to the insulating material. A portion of the insulating material is removed proximate each of the through-vias. The portion of the insulating material proximate each of the through-vias removed has a second width, the second width being less than the first width.
Public/Granted literature
- US20150380340A1 Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices Public/Granted day:2015-12-31
Information query
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