- 专利标题: Semiconductor substrate and method for producing same, substrate, and laminate
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申请号: US16619447申请日: 2018-06-07
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公开(公告)号: US11217739B2公开(公告)日: 2022-01-04
- 发明人: Ryo Teranishi , Shinji Munetoh , Osamu Furukimi
- 申请人: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- 申请人地址: JP Fukuoka
- 专利权人: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- 当前专利权人: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- 当前专利权人地址: JP Fukuoka
- 代理机构: Studebaker & Brackett PC
- 优先权: JPJP2017-114352 20170609
- 国际申请: PCT/JP2018/021877 WO 20180607
- 国际公布: WO2018/225823 WO 20181213
- 主分类号: H01L35/14
- IPC分类号: H01L35/14 ; H01L35/20 ; H01L35/22 ; H01L35/34
摘要:
A semiconductor substrate contains a clathrate compound of the following General Formula (I). The semiconductor substrate includes a variable-composition layer which includes a pn junction and where composition of the clathrate compound varies along a thickness direction. A rate of change in y in the thickness direction of at least a portion of the variable-composition layer is 1×10−4/μm or more. AxByC46-y (I) In General Formula (I), A represents at least one element selected from the group consisting of Ba, Na, Sr, and K, B represents at least one element selected from the group consisting of Au, Ag, Cu, Ni, and Al, and C represents at least one element selected from the group consisting of Si, Ge, and Sn, x is 7 to 9, and y is 3.5 to 6 or 11 to 17.
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