- 专利标题： Plurality of lead frames electrically connected to inductor chip
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申请号： US16671699申请日： 2019-11-01
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公开(公告)号： US11177198B2公开(公告)日： 2021-11-16
- 发明人: Hiroaki Matsubara , Yasumasa Kasuya
- 申请人： ROHM CO., LTD.
- 申请人地址： JP Kyoto
- 专利权人： ROHM CO., LTD.
- 当前专利权人： ROHM CO., LTD.
- 当前专利权人地址： JP Kyoto
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2015-084132 20150416
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/495 ; H05K5/02 ; H01L21/56 ; H01L23/00 ; H01L21/48 ; H01L23/64 ; H01L23/31
摘要：
A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.
公开/授权文献
- US20200066619A1 SEMICONDUCTOR DEVICE 公开/授权日：2020-02-27
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