- 专利标题: Transparent conductive substrate and method for producing same
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申请号: US16465317申请日: 2017-11-29
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公开(公告)号: US11154902B2公开(公告)日: 2021-10-26
- 发明人: Masahiko Toba , Eri Nakazawa , Shigeru Yamaki
- 申请人: SHOW A DENKO K.K.
- 申请人地址: JP Tokyo
- 专利权人: SHOW A DENKO K.K.
- 当前专利权人: SHOW A DENKO K.K.
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JPJP2016-234242 20161201,JPJP2017-144454 20170726
- 国际申请: PCT/JP2017/042823 WO 20171129
- 国际公布: WO2018/101334 WO 20180607
- 主分类号: B32B27/40
- IPC分类号: B32B27/40 ; B05D5/12 ; B05D1/36 ; B05D7/24 ; B32B7/02 ; B32B27/18 ; C08G59/42 ; C08K3/08 ; C08K7/06 ; C08L39/02 ; H01B5/14 ; H01B13/22 ; H05K1/09 ; B32B27/38 ; B32B27/32 ; B82Y10/00 ; B82Y30/00
摘要:
To provide: a transparent conductive substrate containing silver nanowires and having excellent optical characteristics, electrical characteristics and light resistance; and a method for producing the same. A transparent conductive substrate characterized by comprising: a substrate; a transparent conductive film formed on at least one principal surface of the substrate, and containing a binder resin and conductive fibers; and a protective film formed on the transparent conductive film, wherein the thermal decomposition starting temperature of the binder resin is 210° C. or higher, and the protective film is a thermal-cured film obtained using a thermosetting resin.
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