- 专利标题： Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
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申请号： US16194734申请日： 2018-11-19
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公开(公告)号： US11145581B2公开(公告)日： 2021-10-12
- 发明人: Darrell D. Truhitte , James P. Letterman, Jr.
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Adam R. Stephenson, LTD.
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01L21/48 ; H01L21/60
摘要：
A leadless package with wettable flanks is formed by providing a substrate and plating a metal layer onto the substrate to form a contact on the substrate extending across a saw street. An encapsulant is deposited over the contact. The substrate is removed to expose the contact and encapsulant. The encapsulant and contact are singulated. In some embodiments, the substrate includes a ridge, and the contact is formed over the ridge.
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