- 专利标题: Metal gate scheme for device and methods of forming
-
申请号: US16403721申请日: 2019-05-06
-
公开(公告)号: US11127836B2公开(公告)日: 2021-09-21
- 发明人: Chung-Chiang Wu , Chia-Ching Lee , Da-Yuan Lee , Hsueh Wen Tsau
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/49 ; H01L29/78 ; H01L21/28 ; H01L21/8238 ; H01L29/51 ; H01L29/165
摘要:
Gate structures and methods of forming the gate structures are described. In some embodiments, a method includes forming source/drain regions in a substrate, and forming a gate structure between the source/drain regions. The gate structure includes a gate dielectric layer over the substrate, a work function tuning layer over the gate dielectric layer, a metal-containing compound over the work function tuning layer, and a metal over the metal-containing compound, wherein the metal-containing compound comprises the metal as an element of the compound.
公开/授权文献
- US20190259853A1 Metal Gate Scheme for Device and Methods of Forming 公开/授权日:2019-08-22
信息查询
IPC分类: