Invention Grant
- Patent Title: Method to predict yield of a device manufacturing process
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Application No.: US16497826Application Date: 2018-03-29
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Publication No.: US11086229B2Publication Date: 2021-08-10
- Inventor: Alexander Ypma , Cyrus Emil Tabery , Simon Hendrik Celine Van Gorp , Chenxi Lin , Dag Sonntag , Hakki Ergün Cekli , Ruben Alvarez Sanchez , Shih-Chin Liu , Simon Philip Spencer Hastings , Boris Menchtchikov , Christiaan Theodoor De Ruiter , Peter Ten Berge , Michael James Lercel , Wei Duan , Pierre-Yves Jerome Yvan Guittet
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- International Application: PCT/EP2018/058096 WO 20180329
- International Announcement: WO2018/202361 WO 20181108
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
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