A low strength backfill material having a 28 days compressive strength less than approximately 2.0 MPa is provided. The backfill is suitable for use in areas with dense underground utilities due to its high excavatability and good thermal conductivity. The backfill includes a cementitious binder of approximately 1 weight percent to approximately 10 weight percent and fine aggregates in an amount of approximately 40 to approximately 75 weight percent. Filler is provided at 20 microns to approximately 100 microns for high flowability. A density-controlling agent of 0.0001-5 weight percent is used such that the density of a cured backfill material is approximately 1600 kg/m3 to 2000 kg/m3. Thermally conductive particles having a size range of approximately 0.01 microns to 500 microns in an amount of approximately 0.1 to 10 weight percent are evenly dispersed throughout the backfill.