发明授权
- 专利标题： Method of assembly
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申请号： US16309955申请日： 2016-06-21
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公开(公告)号： US11044814B2公开(公告)日： 2021-06-22
- 发明人: Koenraad Alexander Gieskes
- 申请人： Universal Instruments Corporation
- 申请人地址： US NY Conklin
- 专利权人： Universal Instruments Corporation
- 当前专利权人： Universal Instruments Corporation
- 当前专利权人地址： US NY Conklin
- 代理机构： Schmeiser, Olsen & Watts, LLP
- 国际申请： PCT/US2016/038455 WO 20160621
- 国际公布： WO2017/222502 WO 20171228
- 主分类号： H01S4/00
- IPC分类号： H01S4/00 ; H05K1/18 ; H05K13/04 ; H05K1/11
摘要：
A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.
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