Invention Grant
- Patent Title: Metal-insulator-metal (MIM) capacitor structure and method for forming the same
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Application No.: US16593078Application Date: 2019-10-04
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Publication No.: US11031458B2Publication Date: 2021-06-08
- Inventor: Chih-Fan Huang , Chih-Yang Pai , Yuan-Yang Hsiao , Tsung-Chieh Hsiao , Hui-Chi Chen , Dian-Hau Chen , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/64 ; H01G4/10 ; H01G4/012

Abstract:
A metal-insulator-metal (MIM) capacitor structure and a method for forming the same are provided. The MIM capacitor structure includes a substrate, and the substrate includes a capacitor region and a non-capacitor region. The MIM capacitor structure includes a first electrode layer formed over the substrate, and a first spacer formed on a sidewall of the first electrode layer. The MIM capacitor structure includes a first dielectric layer formed on the first spacers, and a second electrode layer formed on the first dielectric layer. The second electrode layer extends from the capacitor region to the non-capacitor region, and the second electrode layer extends beyond an outer sidewall of the first spacer.
Public/Granted literature
- US20200035780A1 METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2020-01-30
Information query
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