Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15489905Application Date: 2017-04-18
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Publication No.: US11024582B2Publication Date: 2021-06-01
- Inventor: Hung-Ming Chen , Yu-Chang Lin , Chung-Ting Li , Jen-Hsiang Lu , Hou-Ju Li , Chih-Pin Tsao
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L23/535 ; H01L29/66 ; H01L29/78 ; H01L21/768 ; H01L29/417

Abstract:
A semiconductor device includes a substrate, a carbon-containing diffusion barrier, a phosphorus-containing source/drain feature, a gate structure, and a gate spacer. The substrate has a channel region. The carbon-containing diffusion barrier is present in the substrate. The phosphorus-containing source/drain feature is present in the substrate, and the carbon-containing diffusion barrier is between the channel region and the phosphorus-containing source/drain feature. The gate is present over the channel region of the substrate. The gate spacer abuts the gate structure and is present over a portion of the phosphorus-containing source/drain feature.
Public/Granted literature
- US20180301417A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-10-18
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