Invention Grant
- Patent Title: Mounting structure for module in electronic device
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Application No.: US16895483Application Date: 2020-06-08
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Publication No.: US11019733B2Publication Date: 2021-05-25
- Inventor: Hyung Dal Kim , Oh Hyuck Kwon , Han Vit Kang , Jun Young Kim , Moon Kyeong Kim , Sang Seob Kim , Jung Sik Park , Hee Seok Jung , Sung Cho , Heung Sik Shin , Ji Woong Oh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2016-0164694 20161205,KR10-2017-0030680 20170310
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/36 ; G06F1/16 ; G06K9/00 ; H05K1/02 ; A61B5/1172 ; G02F1/1333 ; H04M1/02 ; H05K1/18 ; H05K3/34 ; H05K1/14 ; G02F1/1345

Abstract:
A portable communication device is provided that includes a display including a display area and a connecting area extending from one side of the display area; a back panel disposed on a rear surface of the display, the back panel including an opening formed therein; a flexible printed circuit board (FPCB) connected with the connecting area; and a biometric sensor electrically coupled with the FPCB, with the connecting area being housed and bent within the portable communication device such that the biometric sensor is placed under the opening.
Public/Granted literature
- US20200305287A1 MOUNTING STRUCTURE FOR MODULE IN ELECTRONIC DEVICE Public/Granted day:2020-09-24
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