Invention Grant
- Patent Title: Method and apparatus for mitigating adverse effects of bonding wire of external optical modulators
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Application No.: US16554464Application Date: 2019-08-28
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Publication No.: US11009763B2Publication Date: 2021-05-18
- Inventor: Moon Soo Park , Tae Young Jeon
- Applicant: OE Solutions Co., Ltd.
- Applicant Address: KR Gwangju
- Assignee: OE Solutions Co., Ltd.
- Current Assignee: OE Solutions Co., Ltd.
- Current Assignee Address: KR Gwangju
- Agency: Ichthus International Law PLLC
- Main IPC: G02F1/225
- IPC: G02F1/225 ; H04B10/50 ; G02F1/035 ; H04B10/516 ; H04B10/40 ; H04B10/548 ; G02F1/015 ; G02F1/21
Abstract:
An optical transceiver including a submount, a Mach-Zehnder Modulator (MZM), bonding wires, and a low pass filter type matching network is provided. The MZM includes an input port and an output port and disposed on the submount. The bonding wires are coupled to the submount and the MZM. The low pass filter type matching network is coupled to the bonding wires and is configured to absorb inductance of the bonding wires at a high frequency.
Public/Granted literature
- US20200073195A1 METHOD AND APPARATUS FOR MITIGATING ADVERSE EFFECTS OF BONDING WIRE OF EXTERNAL OPTICAL MODULATORS Public/Granted day:2020-03-05
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