- 专利标题： Integrated circuit chip design for symmetric power delivery
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申请号： US16425485申请日： 2019-05-29
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公开(公告)号： US11004783B2公开(公告)日： 2021-05-11
- 发明人: Vlad Radu Calugaru
- 申请人： Microsoft Technology Licensing, LLC
- 申请人地址： US WA Redmond
- 专利权人： Microsoft Technology Licensing, LLC
- 当前专利权人： Microsoft Technology Licensing, LLC
- 当前专利权人地址： US WA Redmond
- 代理机构： Holzer Patel Drennan
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/367 ; H05K1/02
摘要：
An integrated circuit (IC) chip design for symmetric power delivery includes an integrated circuit (IC) chip package with I/O connections exposed on a first surface and power connections exposed on a second opposite surface. At least one voltage regulation module (VRM) is positioned on the second opposite surface and electrically coupled to the power connections on the second opposite surface.
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