- 专利标题: ESD protection diode
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申请号: US16558911申请日: 2019-09-03
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公开(公告)号: US10998451B2公开(公告)日: 2021-05-04
- 发明人: Hideaki Sai
- 申请人: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- 申请人地址: JP Tokyo; JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人地址: JP Tokyo; JP Tokyo
- 代理机构: White & Case LLP
- 优先权: JPJP2019-026009 20190215
- 主分类号: H01L23/62
- IPC分类号: H01L23/62 ; H01L29/861 ; H01L29/06 ; H01L27/02 ; H01L23/552
摘要:
A semiconductor device according to an embodiment includes a semiconductor layer that has first and second plane and includes first-conductivity-type first semiconductor region, second-conductivity-type second semiconductor region between the first semiconductor region and the first plane, first-conductivity-type third semiconductor region between the second semiconductor region and the first plane and has a lower first-conductivity-type impurity concentration than the first semiconductor region, and second-conductivity-type fourth semiconductor region between the third semiconductor region and the first plane and has a higher second-conductivity-type impurity concentration than the second semiconductor region; a first electrode on a side of the first plane of the semiconductor layer and is electrically connected to the third semiconductor region and the fourth semiconductor region; and a second electrode on a side of the second plane of the semiconductor layer, is electrically connected to the first semiconductor region, and is not electrically connected to the second semiconductor region.
公开/授权文献
- US20200266303A1 SEMICONDUCTOR DEVICE 公开/授权日:2020-08-20
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