Invention Grant
- Patent Title: Polyimide hybrid material, precursor solution and manufacture method thereof
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Application No.: US16234073Application Date: 2018-12-27
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Publication No.: US10995237B2Publication Date: 2021-05-04
- Inventor: Dong-Sen Chen , Yu-Ju Kuo , Chyi-Ming Leu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW107147191 20181226
- Main IPC: C09D179/08
- IPC: C09D179/08 ; C08G73/10 ; C08K9/06 ; C09D7/40 ; C09D7/62 ; C08K3/36
Abstract:
A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.
Public/Granted literature
- US20190276704A1 POLYIMIDE HYBRID MATERIAL, PRECURSOR SOLUTION AND MANUFACTURE METHOD THEREOF Public/Granted day:2019-09-12
Information query
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