- 专利标题: Method and apparatus for high throughput photomask curing
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申请号: US16685164申请日: 2019-11-15
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公开(公告)号: US10962889B2公开(公告)日: 2021-03-30
- 发明人: Banqiu Wu , Eli Dagan , Khalid Makhamreh , Bruce J. Fender
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson + Sheridan LLP
- 主分类号: G06F7/20
- IPC分类号: G06F7/20 ; G03F1/66 ; G03F7/20 ; G03F1/22
摘要:
Embodiments of the present disclosure generally relate to methods and apparatus for preparing a photomask for a lithography process. In one embodiment, a curing chamber is disclosed that includes an elevator adapted to receive a plurality of holder units. Each of the holder units comprise a holder, a clamp holding a photomask, one or more studs coupled to the photomask by an adhesive, and a spring coupled to each of the one or more studs.
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