- 专利标题: Multilayer ceramic electronic component
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申请号: US16170499申请日: 2018-10-25
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公开(公告)号: US10957488B2公开(公告)日: 2021-03-23
- 发明人: Min Gon Lee , Seung Woo Song , Jae Yeol Choi , Jin Kyung Joo , Taek Jung Lee , Jin Man Jung
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2018-0046195 20180420,KR10-2018-0090639 20180803
- 主分类号: H01G4/232
- IPC分类号: H01G4/232 ; H01G4/30 ; H01G4/248 ; H01G4/12 ; H01G4/012
摘要:
A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
公开/授权文献
- US20190326058A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 公开/授权日:2019-10-24
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