- 专利标题： Memory module connector, memory module, and pivotable latch
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申请号： US16021269申请日： 2018-06-28
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公开(公告)号： US10950958B2公开(公告)日： 2021-03-16
- 发明人: Phil Geng , Xiang Li , Mani Prakash , George Vergis
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： 2SPL Patent Attorneys PartG mbB
- 代理商 Yong Beom Hwang
- 主分类号： H01R13/62
- IPC分类号： H01R13/62 ; H01R13/64 ; H01R13/627 ; H01R12/70 ; H05K1/14 ; H01R12/73 ; H05K3/36 ; H01R12/72 ; H05K1/11
摘要：
A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.
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