- 专利标题: Reconfigurable interconnect structure in integrated circuits
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申请号: US16791559申请日: 2020-02-14
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公开(公告)号: US10944402B1公开(公告)日: 2021-03-09
- 发明人: SeongJong Kim , Mark A. Anders , Himanshu Kaul
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: H03K19/17756
- IPC分类号: H03K19/17756 ; H01L23/522
摘要:
Some embodiments include apparatuses having a first circuit path including drive units coupled in series between a first node and a first additional node, a second circuit path including drive units coupled in series between a second node and a second additional node, each drive unit of the driver units of the first circuit path and the second circuit path including an inverter, and a transmission gate circuit including an input node and an output node coupled to an input node and an output node, respectively, of the inverter; and control circuitry to provide control information to the transmission gate circuit of each of the driver units of the first circuit path and the second circuit path.
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