- 专利标题： Component-mounting device
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申请号： US16098900申请日： 2017-05-25
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公开(公告)号： US10939599B2公开(公告)日： 2021-03-02
- 发明人: Kouji Ikeda
- 申请人： Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址： JP Osaka
- 专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Pearne & Gordan LLP
- 优先权： JPJP2016-114945 20160609
- 国际申请： PCT/JP2017/019459 WO 20170525
- 国际公布： WO2017/212925 WO 20171214
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; H05K3/34
摘要：
A component-mounting device includes a mounting head, a discharging portion, and a paste receiving portion. The mounting head holds a component. The discharging portion applies paste by spraying to the component held by the mounting head. The paste receiving portion is provided on the mounting head and captures paste that has been discharged from the discharging portion and has failed to reach the component.
公开/授权文献
- US20190166734A1 COMPONENT-MOUNTING DEVICE 公开/授权日：2019-05-30
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