- 专利标题： Millimeter wave communication through device case
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申请号： US16214839申请日： 2018-12-10
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公开(公告)号： US10938089B2公开(公告)日： 2021-03-02
- 发明人: Jozef Thomas Martinus van BEEK , Krishna Tiruchi Natarajan
- 申请人： NXP B.V.
- 申请人地址： NL Eindhoven
- 专利权人： NXP B.V.
- 当前专利权人： NXP B.V.
- 当前专利权人地址： NL Eindhoven
- 主分类号： H01Q1/22
- IPC分类号： H01Q1/22 ; H04B1/40 ; H01Q13/26 ; H01Q23/00 ; H01Q19/30
摘要：
A device, including: a dielectric case or chassis; a first integrated circuit (IC) configured to produce a millimeter wave signal; a first IC antenna configured to receive the millimeter wave signal from the IC and radiate the millimeter wave signal; and a first waveguide configured to guide the radiated millimeter wave signal to the dielectric case, wherein the millimeter wave signal is coupled into to the dielectric case.
公开/授权文献
- US20200185814A1 MILLIMETER WAVE COMMUNICATION THROUGH DEVICE CASE 公开/授权日：2020-06-11
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