发明授权
- 专利标题: Semiconductor devices including stress-inducing layers and methods of forming the same
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申请号: US16184153申请日: 2018-11-08
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公开(公告)号: US10937952B2公开(公告)日: 2021-03-02
- 发明人: Dong Kyu Lee , Young Hyun Kim , Jung Hwan Park , Jung Min Lee , Kyung Ii Hong
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2018-0073291 20180626
- 主分类号: H01L43/10
- IPC分类号: H01L43/10 ; H01L27/22 ; H01L43/02 ; H01L43/08
摘要:
A semiconductor device includes a first electrode disposed on a substrate, a magnetic tunnel junction (MTJ) on the first electrode, a capping layer on the MTJ, a stress-inducing layer on the capping layer, and a second electrode on the stress-inducing layer. The stress-inducing layer may have tensile stress.
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