- 专利标题： Semiconductor module and method for manufacturing semiconductor module
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申请号： US16362120申请日： 2019-03-22
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公开(公告)号： US10937727B2公开(公告)日： 2021-03-02
- 发明人: Yuhei Nishida
- 申请人： FUJI ELECTRIC CO., LTD.
- 申请人地址： JP Kawasaki
- 专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人地址： JP Kawasaki
- 优先权： JPJP2018-88148 20180501
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48 ; H01L23/00
摘要：
A semiconductor module includes a metal plate; a solder applied on the metal plate; a component-to-be-bonded mounted on the solder; and a linear guide portion delineated along a circumference of the component-to-be-bonded on a top surface of the metal plate, and including a metal surface having greater surface roughness than a peripheral region.
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