发明授权
- 专利标题: Coil
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申请号: US16019591申请日: 2018-06-27
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公开(公告)号: US10937588B2公开(公告)日: 2021-03-02
- 发明人: Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
- 申请人: IBIDEN CO., LTD.
- 申请人地址: JP Ogaki
- 专利权人: IBIDEN CO., LTD.
- 当前专利权人: IBIDEN CO., LTD.
- 当前专利权人地址: JP Ogaki
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2017-124866 20170627
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F5/00 ; H01F17/00 ; H02K3/00 ; H02K41/03
摘要:
A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
公开/授权文献
- US20180374630A1 COIL 公开/授权日:2018-12-27
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