- 专利标题: Mask blank, phase shift mask, phase shift mask manufacturing method, and semiconductor device manufacturing method
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申请号: US15743783申请日: 2016-07-11
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公开(公告)号: US10935881B2公开(公告)日: 2021-03-02
- 发明人: Takenori Kajiwara , Hiroaki Shishido , Osamu Nozawa
- 申请人: HOYA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: HOYA CORPORATION
- 当前专利权人: HOYA CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JPJP2015-141317 20150715
- 国际申请: PCT/JP2016/070405 WO 20160711
- 国际公布: WO2017/010452 WO 20170119
- 主分类号: G03F1/32
- IPC分类号: G03F1/32 ; G03F1/54 ; G03F1/58 ; G03F1/80 ; G03F1/82 ; H01L21/033
摘要:
An object is to provide a mask blank for manufacturing a phase shift mask in which a thermal expansion of a phase shift pattern, which is caused when exposure light is radiated onto the phase shift pattern, and displacement of the phase shift pattern are suppressed to be small. A phase shift film has a function of transmitting exposure light from an ArF excimer laser at a transmittance of 2% or higher and 30% or lower and a function of generating a phase difference of 150° or larger and 180° or smaller between the exposure light that has been transmitted through the phase shift film and the exposure light that has passed through air by a distance equal to a thickness of the phase shift film. The phase shift film is formed of a material containing a metal and silicon, and has a structure in which a lower layer and an upper layer are laminated in the stated order from a transparent substrate side. The lower layer has a refractive index n at a wavelength of the exposure light that is smaller than that of the transparent substrate. The upper layer has a refractive index n at the wavelength of the exposure light that is larger than that of the transparent substrate. The lower layer has an extinction coefficient k at the wavelength of the exposure light that is larger than that of the upper layer. The upper layer has a thickness that is larger than that of the lower layer.
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