发明授权
- 专利标题: Anti-EMI antenna
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申请号: US16527125申请日: 2019-07-31
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公开(公告)号: US10931010B1公开(公告)日: 2021-02-23
- 发明人: Yi-Cheng Lin , Mike Chun-Hung Wang , He-Sheng Lin
- 申请人: KaiKuTek Inc.
- 申请人地址: TW Taipei
- 专利权人: KaiKuTek Inc.
- 当前专利权人: KaiKuTek Inc.
- 当前专利权人地址: TW Taipei
- 代理机构: Rabin & Berdo, P.C.
- 主分类号: H01Q1/52
- IPC分类号: H01Q1/52 ; H01Q1/38 ; H01Q9/04 ; H01Q5/328
摘要:
An anti-EMI antenna includes a first substrate layer, a grounding layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth circuit layer. The grounding layer is mounted on a bottom surface of the first substrate layer, and includes a grounding circuit. The grounding circuit fully covers the bottom surface of the first substrate layer. Since the grounding circuit fully covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent the EMI from a bottom side of the anti-EMI antenna. Therefore, electromagnetic waves can be mostly isolated to prevent noise caused by the EMI.
公开/授权文献
- US20210036418A1 ANTI-EMI ANTENNA 公开/授权日:2021-02-04
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