A system may include a first resistive-inductive-capacitive sensor, a second resistive-inductive-capacitive sensor, and a measurement circuit communicatively coupled to the first resistive-inductive-capacitive sensor and the second resistive-inductive-capacitive sensor and configured to measure first phase information associated with the first resistive-inductive-capacitive sensor, measure second phase information associated with the second resistive-inductive-capacitive sensor, and based on the first phase information and the second phase information, determine a displacement of a mechanical member relative to the first resistive-inductive-capacitive sensor.