- 专利标题: Transistor channel having vertically stacked nanosheets coupled by fin-shaped bridge regions
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申请号: US16286733申请日: 2019-02-27
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公开(公告)号: US10903369B2公开(公告)日: 2021-01-26
- 发明人: Ruilong Xie , Julien Frougier , Chanro Park , Edward Nowak , Yi Qi , Kangguo Cheng , Nicolas Loubet
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Joseph Petrokaitis
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L29/66 ; H01L21/30 ; H01L29/423 ; H01L21/225 ; H01L21/762
摘要:
Embodiments of the present invention are directed to techniques for providing an novel field effect transistor (FET) architecture that includes a center fin region and one or more vertically stacked nanosheets. In a non-limiting embodiment of the invention, a non-planar channel region is formed having a first semiconductor layer, a second semiconductor layer, and a fin-shaped bridge layer between the first semiconductor layer and the second semiconductor layer. Forming the non-planar channel region can include forming a nanosheet stack over a substrate, forming a trench by removing a portion of the nanosheet stack, and forming a third semiconductor layer in the trench. Outer surfaces of the first semiconductor layer, the second semiconductor layer, and the fin-shaped bridge region define an effective channel width of the non-planar channel region.
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