A semiconductor package assembly and method for forming the same are provided. The semiconductor package assembly includes a first semiconductor die and a second semiconductor die disposed on a first surface of a substrate. The first semiconductor die includes a peripheral region having a second edge facing the first edge of the second semiconductor die and a third edge opposite to the second edge, a circuit region surrounded by the peripheral region, wherein the circuit region has a fourth edge adjacent to the second edge and a fifth edge adjacent to the third edge. A minimum distance between the second edge and the fourth edge is a first distance, a minimum distance between the third edge and the fifth edge is a second distance, and the first distance is different from the second distance.