- 专利标题： Semiconductor module, electric vehicle, and power control unit
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申请号： US16257028申请日： 2019-01-24
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公开(公告)号： US10903149B2公开(公告)日： 2021-01-26
- 发明人: Koichiro Iyama
- 申请人： FUJI ELECTRIC CO., LTD.
- 申请人地址： JP Kanagawa
- 专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人地址： JP Kanagawa
- 优先权： JP2017-019964 20170206
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L29/66 ; H05K7/20 ; H01L23/367 ; H01L25/18 ; H01L23/48 ; H01L25/07
摘要：
A semiconductor module is provided to include: a plurality of semiconductor chips; a lead frame that is connected to the plurality of semiconductor chips; and a main terminal that is connected to the lead frame, wherein the lead frame has an electrical connection portion that electrically connects the plurality of semiconductor chips to the main terminal, and a heat dissipation portion that is provided to extend from the electrical connection portion. The heat dissipation portion does not extend a path of a current that flows between the main terminal and the plurality of semiconductor chips.
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