Invention Grant
- Patent Title: Adding cutting stations to bending systems
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Application No.: US15906985Application Date: 2018-02-27
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Publication No.: US10898977B2Publication Date: 2021-01-26
- Inventor: Kyong Chan Lim
- Applicant: Seoul Laser Dieboard System Co., Ltd.
- Applicant Address: US CA Lake Forest
- Assignee: Seoul Laser Dieboard System Co., Ltd.
- Current Assignee: Seoul Laser Dieboard System Co., Ltd.
- Current Assignee Address: US CA Lake Forest
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: B23P15/40
- IPC: B23P15/40 ; B23P15/24 ; B21D5/00 ; B65H35/06 ; B23P21/00 ; B23D33/00 ; B65H35/00 ; B31D1/00 ; B26D3/08 ; B31B50/20 ; B31B50/25 ; B26F1/44 ; B31B50/14 ; B31B100/00

Abstract:
A system for generating rules inserted into at least one pattern board including: a controller configured to generate at least one shape diagram, the controller also configured to determine number and measurement of crease rules to be generated based on the at least one shape diagram; a cutting station configured to receive and cut a first crease rule into the number and measurement of the crease rules; and a sorter configured to receive the crease rules from the cutting station and sort the crease rules according to the measurement of the crease rules, wherein the sorted crease rules are inserted into each of the at least one pattern board along with a cutting rule shaped by each of at least one bender.
Public/Granted literature
- US20180244011A1 ADDING CUTTING STATIONS TO BENDING SYSTEMS Public/Granted day:2018-08-30
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