- 专利标题： Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
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申请号： US15926552申请日： 2018-03-20
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公开(公告)号： US10808150B2公开(公告)日： 2020-10-20
- 发明人: Sadaaki Kato , Mika Kimura , Aya Ikeda , Shinjiro Fujii
- 申请人： HITACHI CHEMICAL COMPANY, LTD.
- 申请人地址： JP Tokyo
- 专利权人： HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人： HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitch, Even, Tabin & Flannery, L.L.P.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4cddc367 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@15467623
- 主分类号： C09J133/14
- IPC分类号： C09J133/14 ; C08F220/18 ; C08F220/34 ; C09J4/06 ; C09J133/06 ; H01L27/146 ; C08F220/32
摘要：
A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
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