A method for forming a multilevel leadframe for an integrated circuit is provided. A conductive sheet is etched from one side to form a thinner region within a frame region for leads lines and bond pads. The conductive sheet is etched to form a plurality of bond pads in a first level of the thinner region arranged in at least a first row and a second row. Each bond pad has a pad width and is separated from an adjacent bond pad by a bond pad clearance distance. The conductive sheet is etched from an opposite side to form a plurality of lead lines in a second level of the thinner region having a line width and is separated from an adjacent lead line by at least a lead line clearance distance. Each bond pad of the second plurality of bond pads is connected to one of the plurality of lead lines on the second level that is routed between adjacent bond pads in the first row, so that the lead lines are routed on a different level from the bond pads.