Invention Grant
- Patent Title: Semiconductor package and method for manufacturing the same
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Application No.: US15901355Application Date: 2018-02-21
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Publication No.: US10797005B2Publication Date: 2020-10-06
- Inventor: Chen-Shien Chen , Ming-Da Cheng , Ming-Chih Yew , Yu-Tse Su
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/52 ; H01L27/02 ; H01L23/538 ; H01L23/498 ; H01L21/683 ; H01L23/31
Abstract:
A semiconductor package includes a die including a first surface and a second surface opposite to the first surface, a warpage control unit disposed over the second surface of the die and entirely overlapping the second surface of the die, and a molding compound surrounding the die and the warpage control unit. The warpage control unit includes an adhesive portion disposed over the second surface of the die and a warpage adjustable portion sandwiched between the adhesive portion and the die.
Public/Granted literature
- US20190164907A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-05-30
Information query
IPC分类:
