- 专利标题： Package assembly for thin wafer shipping and method of use
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申请号： US16588082申请日： 2019-09-30
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公开(公告)号： US10784137B2公开(公告)日： 2020-09-22
- 发明人: Damyon L. Corbin , Charles F. Musante
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： CA Ottawa
- 专利权人： ELPIS TECHNOLOGIES INC.
- 当前专利权人： ELPIS TECHNOLOGIES INC.
- 当前专利权人地址： CA Ottawa
- 代理机构： Roberts Calderon Safran & Cole, P.C.
- 代理商 Michael McCartney; Andrew M. Calderon
- 主分类号： H01L21/673
- IPC分类号： H01L21/673 ; B65B5/06 ; B65B7/16 ; B65B61/20
摘要：
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
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