Method for improved cut metal patterning
Abstract:
A method of preparing an integrated circuit device design including analyzing a preliminary device layout to identify a vertical abutment between a first cell and a second cell, the locations of, and spacing between, internal metal cuts within the first and second cells, indexing the second cell relative to the first cell by N CPP to define one or more intermediate device layouts to define a modified device layout with improved internal metal cut spacing in order to suppress BGE and LE.
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