- 专利标题: Reduction of condensed gases on chamber walls via heated chamber housing for semiconductor processing equipment
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申请号: US16239995申请日: 2019-01-04
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公开(公告)号: US10714317B1公开(公告)日: 2020-07-14
- 发明人: John F. Baggett
- 申请人: Axcelis Technologies, Inc.
- 申请人地址: US MA Beverly
- 专利权人: Axcelis Technologies, Inc.
- 当前专利权人: Axcelis Technologies, Inc.
- 当前专利权人地址: US MA Beverly
- 代理机构: Eschweiler & Potashnik, LLC
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; H01L21/265 ; H01L21/67 ; H01J37/317 ; H01L21/683
摘要:
A workpiece processing system has a chamber with one or more chamber walls defining surfaces enclosing a chamber volume. One or more chamber wall heaters selectively heat the chamber walls to a chamber wall temperature. A workpiece support within the chamber selectively supports a workpiece having one or more materials having a respective condensation temperature, above which, the one or more materials are respectively in a gaseous state. A heater apparatus selectively heats the workpiece to a predetermined temperature. A controller heats the workpiece to the predetermined temperature by controlling the heater apparatus, heating the one or more materials to respectively form one or more outgassed materials within the chamber volume. The controller further controls the chamber wall temperature by controlling the chamber wall heaters, where the chamber wall temperature is greater than a condensation temperature of the outgassed materials, preventing condensation of the outgassed material on the chamber surfaces.
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