Invention Grant
- Patent Title: MEMS device including a capacitive pressure sensor and manufacturing process thereof
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Application No.: US16522301Application Date: 2019-07-25
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Publication No.: US10689251B2Publication Date: 2020-06-23
- Inventor: Enri Duqi , Lorenzo Baldo , Roberto Carminati
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6494cc3c
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/02 ; B81B3/00

Abstract:
MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
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